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COMPLIANCE EVALUATION

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Upload microsection image for IPC Class 2/3 evaluation

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Class 2

—

Class 3

—

Analysis Time -

Confidence -

Findings -

<3s

Processing

99.2%

Accuracy

Class 3

IPC-6012

0.1μm

Precision

IPC-6012 CLASS 2/3 REQUIREMENTS — MEASUREMENTS IN INCHES

Parameter	Class 2	Class 3
CU Avg Thickness	.000787"	.000984"
CU Min Thickness	.000709"	.000787"
Wrap Plating	.000197"	.000472"
Cap Plating	.000197"	.000472"
Dimple	.005" max	.003" max
Bump	.002" max	.002" max
Etchback	.000197" min – .00315" max	.000197" min – .00315" max
A/R Internal	.000984"	.000984"
A/R External	.000984"	.001969"
Plating Void	1 per hole, max 5%	NONE
Inner Layer Separation	None	NONE
Ext. Layer Separation	Only on vertical edge	Only on vertical edge
Microvia Aspect Ratio	.00315" max	.00315" max
Microvia Size	.00315" max	.00315" max
Lane Cracks / Barrel Voids	—	—
Dielectric + Foil	—	—

                BLUEPRINT REQUIREMENTS SUPERSEDE ANY OF THESE REQUIREMENTS
            

IPC TEST METHODS APPLIED

TM-650 2.1.1

Microsection

Cross-section prep

TM-650 2.6.8

Thermal Stress

Solder float test

TM-650 2.6.27

Reflow Sim

Thermal cycling

IPC-9252

E-Test

Electrical testing

DEFECT DETECTION CATEGORIES

Plating

8 Types

Voids, cracks, folds

Laminate

6 Types

Delamination, voids

PTH/Via

12 Types

Barrel, knee cracks

Surface

16 Types

Etch, mask, finish